Stencil Wiping Rolls

Understencil Wiping Rolls are a critical part of the SMT PCB assembly process. Using high quality rolls can reduce or prevent defect-causing smearing, bridging, and solder balls produced by normal printing of solder paste onto PC Boards. This is why we utilize only the best materials to manufacture our understencil wiping rolls. Our two most popular options are Green Monster® and SmartRolls®. Both lines exceed the demanding requirements of the equipment manufacturer and combine to offer the widest range of OEM compatible rolls on the market.

 

These rolls are fully compatible with major automatic screen printer brands, including:

  • Speedline / MPM
  • DEK
  • Fuji
  • Panasonic
  • Sony
  • Yamaha
  • EKRA
  • And more.

Green Monster

Green Monster™ is an advanced stencil wiping roll designed specifically for high-performance electronics assembly, engineered to increase productivity and operational efficiency.

  • True ESD Safe: The first stencil wiping roll designed to be genuinely ESD safe, preventing critical damage to sensitive equipment and components caused by static discharge.
  • Superior Cleaning: Comprised of coarse rayon and ESD polyester bonded by a proprietary copolymer formula, creating an aggressive surface that effectively scrapes and collects solder paste from stencil apertures.
  • Virtually Lint-Free: Unlike traditional paper rolls that shed fibers, Green Monster™ is virtually lint-free, significantly reducing defects such as solder bridging or blocked apertures.
  • Vacuum Efficiency: Features a 485 CFM porosity, optimizing vacuum system performance in screen printers for effective solder paste extraction.
  • Lead-Free Compatible: Fully compatible with modern lead-free assembly processes.
  • Cost-Effective & XL Options: Available in extra-long (XL) versions to reduce roll change frequency and minimize line downtime, offering significant long-term savings.
Más Información

SMART ROLLS

SmartRolls® Stencil Wiping Rolls

The industry standard in understencil cleaning, engineered to optimize SMT PCB assembly processes.

  • High-Performance Material: Made from hydroentangled cellulose/polyester that is absorbent, strong, and virtually lint-free, effectively preventing aperture blockage and contamination.
  • Superior Cleaning: Effectively removes residual adhesives, solder pastes, and fluxes (with or without solvents) to prevent defects like bridging, smearing, and solder balls.
  • Optimized Vacuum Efficiency: Excellent airflow characteristics ensure vacuum power remains uncompromised during cleaning.
  • ESD Protection: Individually shrink-wrapped in static-dissipative ESD-safe film for superior static control and unlimited shelf life.

Durability & Versatility: High tear resistance reduces operator intervention and lowers production costs. Available in a wide range of OEM-compatible standard and custom configurations.

Más Información